Maintenance fees coming due

Advanced Semiconductor Engineering, Inc.

275 maintenance fees come due in the 12 months from Nov 14, 2026, the next on Nov 16, 2026. Unpaid by May 17, 2027, that one lapses early.

A maintenance fee does not end a patent on its due date. It falls due at 3.5, 7.5 and 11.5 years from grant, and the patent lapses only if the fee is still unpaid at the end of the six month grace period that follows.

Patent	Title	Holder	Status	Fee due	Lapses if unpaid	Expires	Confidence
US 11,652,014	Electronic Package and Method of Manufacturing the Same Advanced Semiconductor Engineering, Inc. In force Fee due Nov 16, 2026 Lapses if unpaid May 17, 2027 Term ends Feb 2, 2041 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 16, 2026	May 17, 2027	Term ends Feb 2, 2041	High confidence
US 11,652,081	Method for Manufacturing Semiconductor Package Structure Advanced Semiconductor Engineering, Inc. In force Fee due Nov 16, 2026 Lapses if unpaid May 17, 2027 Term ends Jul 7, 2041 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 16, 2026	May 17, 2027	Term ends Jul 7, 2041	High confidence
US 11,655,992	Measuring System Advanced Semiconductor Engineering, Inc. In force Fee due Nov 23, 2026 Lapses if unpaid May 24, 2027 Term ends Nov 26, 2038 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 23, 2026	May 24, 2027	Term ends Nov 26, 2038	High confidence
US 11,658,102	Semiconductor Device Package and Method of Manufacturing the Same Advanced Semiconductor Engineering, Inc. In force Fee due Nov 23, 2026 Lapses if unpaid May 24, 2027 Term ends Jan 24, 2040 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 23, 2026	May 24, 2027	Term ends Jan 24, 2040	High confidence
US 11,658,170	Semiconductor Package Structure and Methods of Manufacturing the Same Advanced Semiconductor Engineering, Inc. In force Fee due Nov 23, 2026 Lapses if unpaid May 24, 2027 Term ends Mar 26, 2041 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 23, 2026	May 24, 2027	Term ends Mar 26, 2041	High confidence
US 10,304,765	Semiconductor Device Package Advanced Semiconductor Engineering, Inc. In force Fee due Nov 28, 2026 Lapses if unpaid May 28, 2027 Term ends Jun 10, 2037 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 28, 2026	May 28, 2027	Term ends Jun 10, 2037	High confidence
US 11,664,301	Semiconductor Device Package Advanced Semiconductor Engineering, Inc. In force Fee due Nov 30, 2026 Lapses if unpaid Jun 1, 2027 Term ends Apr 30, 2041 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 30, 2026	Jun 1, 2027	Term ends Apr 30, 2041	High confidence
US 11,664,339	Package Structure and Method for Manufacturing the Same Advanced Semiconductor Engineering, Inc. In force Fee due Nov 30, 2026 Lapses if unpaid Jun 1, 2027 Term ends Feb 24, 2041 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 30, 2026	Jun 1, 2027	Term ends Feb 24, 2041	High confidence
US 11,664,580	Semiconductor Package Including Antenna Substrate and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. In force Fee due Nov 30, 2026 Lapses if unpaid Jun 1, 2027 Term ends Jul 13, 2036 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Nov 30, 2026	Jun 1, 2027	Term ends Jul 13, 2036	High confidence
US 10,312,198	Semiconductor Device Package Advanced Semiconductor Engineering, Inc. In force Fee due Dec 4, 2026 Lapses if unpaid Jun 4, 2027 Term ends Oct 20, 2037 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Dec 4, 2026	Jun 4, 2027	Term ends Oct 20, 2037	High confidence
265 more maintenance fees coming due in the 12 months from Nov 14, 2026 · Pro

10 of 275 patents shown. Soonest fee due date first, then patent number.

Pro members see every patent with a maintenance fee coming due: number, title, status, the due date, and the date it lapses if the fee goes unpaid through the grace period.

Upgrade to Pro

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.