1,400 patents currently held
7 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
3 more records may belong here and await a decision; they are not counted.
The next term ends in Nov 2026. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
219
Ending by 2030
Nov 2026
Next term end
1,144
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Jun 2037 · High confidence
Also notable
Ends no later than Dec 2028 · Medium confidence
Also notable
Ends Jun 2039 · High confidence
Semiconductor Device Packages and Stacked Package Assemblies Including High Density Interconnections
US 10,276,382
Cited by 42 later US patents, top 5% of utility patents granted in 2019 in our data, and renewed at 2 of 3 maintenance windows. Protection runs to 2037.
Semiconductor Device Packages with Electromagnetic Interference Shielding
US 7,989,928
Cited by 89 later US patents, top 10% of utility patents granted in 2011 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2028. A terminal disclaimer is on file and its reference is not resolved, so no cap is applied and the date may move earlier, never later.
Device Package
US 11,037,891
Cited by 15 later US patents, top 10% of utility patents granted in 2021 in our data. Protection runs to 2039.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 9 fees due Nov 16 to 30, 2026 · next Nov 16
- 25 fees due Dec 4 to 30, 2026 · next Dec 4
- 11 fees due Jan 2 to 28, 2027 · next Jan 2
- 28 fees due Feb 1 to 28, 2027 · next Feb 1
- 22 fees due Mar 1 to 29, 2027 · next Mar 1
- 41 fees due Apr 1 to 30, 2027 · next Apr 1
- 24 fees due May 5 to 28, 2027 · next May 5
- 26 fees due Jun 3 to 30, 2027 · next Jun 3
- 28 fees due Jul 2 to 30, 2027 · next Jul 2
- 20 fees due Aug 4 to 27, 2027 · next Aug 4
- 15 fees due Sep 3 to 26, 2027 · next Sep 3
- 21 fees due Oct 2 to 30, 2027 · next Oct 2
- 5 fees due Nov 5 to 12, 2027 · next Nov 5
Recent changes
- Oct 30Assignment recorded on 1 record: Hsieh, Sheng-Chi and 1 other to Advanced Semiconductor Engineering, Inc. Recorded Oct 30, 2026, executed Feb 1, 2023. Conveyance as recorded: Assignment of Assignor's Interest. A recorded assignment is a filed document, not a statement of current ownership. Reel 76586, frame 287.
- 28 of the patents on this record were granted since Aug 16, 2026
- 18 terms have ended since Aug 16, 2026
What they patent
The 5 largest of its 1,144 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Method for Forming Vias in a Substrate | 7 in force | to Aug 2031 |
| Embedded Component Package Structure and Manufacturing Method Thereof | 5 in force | to Oct 2038 |
| Substrate, Semiconductor Device Package and Method of Manufacturing the Same | 4 in force | to Sep 2038 |
| Semiconductor Device Package and Method for Manufacturing the Same | 4 in force | to Jul 2038 |
| Semiconductor Device Package and a Method of Manufacturing the Same | 4 in force | to Dec 2037 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,492,037 | Package Structure and Lead Frame Using the Same In force · High confidence | In force | High confidence | |
| US 7,443,253 | Detection Device for Detecting Oscillator In force · High confidence | In force | High confidence | |
| US 8,866,280 | Chip Package In force · High confidence | In force | High confidence | |
| US 7,432,127 | Chip Package and Package Process Thereof In force · High confidence | In force | High confidence | |
| US 7,473,629 | Substrate Structure Having a Solder Mask and a Process for Making the Same In force · High confidence | In force | High confidence | |
| US 7,833,837 | Chip Scale Package and Method for Manufacturing the Same In force · High confidence | In force | High confidence | |
| US 7,425,468 | Method for Making Flip Chip on Leadframe Package In force · High confidence | In force | High confidence | |
| US 7,538,421 | Flip-Chip Package Structure with Stiffener In force · High confidence | In force | High confidence | |
| US 7,795,722 | Substrate Strip and Substrate Structure and Method for Manufacturing the Same In force · High confidence | In force | High confidence | |
| US 7,388,396 | Strip Test Method In force · High confidence | In force | High confidence |
Also on record, not counted in the 1,400: 7 patents in force now held by others · 431 patents ended · 284 applications pending · 479 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.