Method for Forming Vias in a Substrate

Advanced Semiconductor Engineering, Inc.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

Patent	Title	Holder	Status	Expires	Time remaining	Confidence
US 8,546,255	Method for Forming Vias in a Semiconductor Substrate and a Semiconductor Device Having the Semiconductor Substrate Advanced Semiconductor Engineering, Inc. In force Term ends Nov 28, 2028 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Nov 28, 2028	Term ends Nov 28, 2028	High confidence
US 7,816,265	Method for Forming Vias in a Substrate Advanced Semiconductor Engineering, Inc. In force Term ends Jan 6, 2029 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Jan 6, 2029	Term ends Jan 6, 2029	High confidence
US 7,944,038	Semiconductor Package Having an Antenna on the Molding Compound Thereof Advanced Semiconductor Engineering, Inc. In force Term ends Apr 30, 2029 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Apr 30, 2029	Term ends Apr 30, 2029	High confidence
US 8,685,863	Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element Advanced Semiconductor Engineering, Inc. In force Term ends Jun 8, 2030 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Jun 8, 2030	Term ends Jun 8, 2030	High confidence
US 8,072,064	Semiconductor Package and Method for Making the Same Advanced Semiconductor Engineering, Inc. In force Term ends Jun 21, 2030 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Jun 21, 2030	Term ends Jun 21, 2030	High confidence
US 8,368,227	Semiconductor Element and Package Having Semiconductor Element Advanced Semiconductor Engineering, Inc. In force Term ends Sep 29, 2030 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Sep 29, 2030	Term ends Sep 29, 2030	High confidence
US 8,368,202	Semiconductor Device and Semiconductor Package Having the Same Advanced Semiconductor Engineering, Inc. In force Term ends Aug 1, 2031 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Aug 1, 2031	Term ends Aug 1, 2031	High confidence
US 8,252,629	Method for Making a Stackable Package Advanced Semiconductor Engineering, Inc. Lapsed Aug 28, 2024 on the fee record Ended Aug 28, 2024 · High confidence	Advanced Semiconductor Engineering, Inc.	Lapsed Aug 28, 2024 on the fee record	Ended Aug 28, 2024	Ended Aug 28, 2024	High confidence
US 8,466,553	Semiconductor Device and Semiconductor Package Having the Same Advanced Semiconductor Engineering, Inc. Lapsed Jun 18, 2025 on the fee record Ended Jun 18, 2025 · High confidence	Advanced Semiconductor Engineering, Inc.	Lapsed Jun 18, 2025 on the fee record	Ended Jun 18, 2025	Ended Jun 18, 2025	High confidence

9 of 9 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

7 of these are in force and held by Advanced Semiconductor Engineering, Inc..

Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.