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Substrate, Semiconductor Device Package and Method of Manufacturing the Same

Advanced Semiconductor Engineering, Inc.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 3 of these applications claim priority to application 15/976,772, filed May 10, 2018. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
PatentTitleHolderStatusExpiresTime remainingConfidence
US 10,615,109Substrate, Semiconductor Device Package and Method of Manufacturing the Same
In force
 · High confidence
Advanced Semiconductor Engineering, Inc.In force
High confidence
US 11,088,061Substrate, Semiconductor Device Package and Method of Manufacturing the Same
In force
 · High confidence
Advanced Semiconductor Engineering, Inc.In force
High confidence
US 12,165,963Substrate, Semiconductor Device Package and Method of Manufacturing the Same
In force
 · High confidence
Advanced Semiconductor Engineering, Inc.In force
High confidence
US 11,776,885Substrate, Semiconductor Device Package and Method of Manufacturing the Same
In force
 · High confidence
Advanced Semiconductor Engineering, Inc.In force
High confidence
Application 18/976,255Substrate, Semiconductor Device Package and Method of Manufacturing the Same
Pending
Not granted
Advanced Semiconductor Engineering, Inc.PendingNot grantednot computed
5 of 5 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
4 of these are in force and held by Advanced Semiconductor Engineering, Inc..
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
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