Semiconductor Device Package and Method for Manufacturing the Same
Advanced Semiconductor Engineering, Inc.
A patent family: one line of work, grouped by real continuity rather than by a technology label
inferred from titles. 4 of these applications claim priority to application 62/482,431, filed Apr 6, 2017. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
| Patent | Title | Holder | Status | Expires | Time remaining | Confidence |
|---|---|---|---|---|---|---|
| US 10,522,505 | Semiconductor Device Package and Method for Manufacturing the Same In force · High confidence | Advanced Semiconductor Engineering, Inc. | In force | High confidence | ||
| US 10,937,761 | Semiconductor Device Package and Method for Manufacturing the Same In force · High confidence | Advanced Semiconductor Engineering, Inc. | In force | High confidence | ||
| US 12,272,671 | Semiconductor Device Package and Method for Manufacturing the Same In force · High confidence | Advanced Semiconductor Engineering, Inc. | In force | High confidence | ||
| US 11,682,653 | Semiconductor Device Package and Method for Manufacturing the Same In force · High confidence | Advanced Semiconductor Engineering, Inc. | In force | High confidence | ||
| Application 19/173,803 | Semiconductor Device Package and Method for Manufacturing the Same Pending Not granted | Advanced Semiconductor Engineering, Inc. | Pending | Not granted | not computed |
5 of 5 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
4 of these are in force and held by Advanced Semiconductor Engineering, Inc..
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.