Embedded Component Package Structure and Manufacturing Method Thereof

Advanced Semiconductor Engineering, Inc.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 4 of these applications claim priority to application 16/159,264, filed Oct 12, 2018. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

Patent	Title	Holder	Status	Expires	Time remaining	Confidence
US 10,757,813	Embedded Component Package Structure and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. In force Term ends Oct 12, 2038 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Oct 12, 2038	Term ends Oct 12, 2038	High confidence
US 11,032,911	Embedded Component Package Structure and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. In force Term ends Oct 12, 2038 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Oct 12, 2038	Term ends Oct 12, 2038	High confidence
US 11,553,596	Embedded Component Package Structure and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. In force Term ends Oct 12, 2038 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Oct 12, 2038	Term ends Oct 12, 2038	High confidence
US 11,882,660	Embedded Component Package Structure and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. In force Term ends Oct 12, 2038 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Oct 12, 2038	Term ends Oct 12, 2038	High confidence
US 12,267,961	Embedded Component Package Structure and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. In force Term ends Oct 12, 2038 · High confidence	Advanced Semiconductor Engineering, Inc.	In force	Term ends Oct 12, 2038	Term ends Oct 12, 2038	High confidence
Application 19/093,231	Embedded Component Package Structure and Manufacturing Method Thereof Advanced Semiconductor Engineering, Inc. Pending Not granted	Advanced Semiconductor Engineering, Inc.	Pending	Not granted	not computed

6 of 6 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

5 of these are in force and held by Advanced Semiconductor Engineering, Inc..

Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.