Bell Semiconductor, LLC
Records under this name other than the patents Bell Semiconductor, LLC holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 153 patents it holds.
Back to Bell Semiconductor, LLC
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,817,434 | Method and Apparatus for Improving Thermal Energy Dissipation in a Direct-Chip-Attach Coupling Configuration of an Integrated Circuit and a Circuit Board now held by Bell Northern Research, LLC In force · Medium confidence | In force | Medium confidence | |
| US 7,373,622 | Relocatable Built-In Self Test (BIST) Elements for Relocatable Mixed-Signal Elements Term ended Term ended Nov 2, 2026 · High confidence | Term ended | Term ended Nov 2, 2026 | High confidence |
| US 7,408,227 | Apparatus and Method of Manufacture for Integrated Circuit and CMOS Device Including Epitaxially Grown Dielectric on Silicon Carbide Term ended Term ended Sep 29, 2026 · High confidence | Term ended | Term ended Sep 29, 2026 | High confidence |
| US 7,847,666 | Differential Inductor for Use in Integrated Circuits Term ended Term ended Sep 27, 2026 · High confidence | Term ended | Term ended Sep 27, 2026 | High confidence |
| US 7,494,842 | Programmable Nanotube Interconnect Term ended Term ended Sep 24, 2026 · High confidence | Term ended | Term ended Sep 24, 2026 | High confidence |
| US 8,106,480 | Bipolar Device Having Improved Capacitance Term ended Term ended Sep 13, 2026 · High confidence | Term ended | Term ended Sep 13, 2026 | High confidence |
| US 7,709,861 | Systems and Methods for Supporting a Subset of Multiple Interface Types in a Semiconductor Device Term ended Term ended Sep 11, 2026 · High confidence | Term ended | Term ended Sep 11, 2026 | High confidence |
| US 7,436,040 | Method and Apparatus for Diverting Void Diffusion in Integrated Circuit Conductors Term ended Term ended Sep 9, 2026 · High confidence | Term ended | Term ended Sep 9, 2026 | High confidence |
| US 8,507,317 | Solder Bump Structure for Flip Chip Semiconductor Devices and Method of Manufacture Therefore Term ended Term ended Aug 28, 2026 · High confidence | Term ended | Term ended Aug 28, 2026 | High confidence |
| US 7,498,664 | Semiconductor Package Having Increased Resistance to Electrostatic Discharge Term ended Term ended Aug 26, 2026 · High confidence | Term ended | Term ended Aug 26, 2026 | High confidence |