Bondtech Co., Ltd.
2 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
2
Ending by 2030
Feb 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Mar 22, 2027The maintenance fee for Chip-On-Wafer Bonding Method and Bonding Device, and Structure Comprising Chip and Wafer (US 9,142,532) comes due Mar 22, 2027. Unpaid by Sep 22, 2027, it lapses early.
- 1 fee due Jun 5, 2027The maintenance fee for Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device (US 11,837,444) comes due Jun 5, 2027. Unpaid by Dec 6, 2027, it lapses early.
- 1 fee due Jul 26, 2027The maintenance fee for Pressure application apparatus and pressure application method (US 9,243,894) comes due Jul 26, 2027. Unpaid by Jan 26, 2028, it lapses early.
- 1 fee due Sep 3, 2027The maintenance fee for Method for bonding substrates together, and substrate bonding device (US 10,580,752) comes due Sep 3, 2027. Unpaid by Mar 3, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,784,670 | Joining method and device produced by this method and joining unit In force · From the USPTO record | In force | From the USPTO record | |
| US 9,379,082 | Pressure application apparatus and pressure application method In force · From the USPTO record | In force | From the USPTO record | |
| US 9,243,894 | Pressure application apparatus and pressure application method In force · From the USPTO record | In force | From the USPTO record | |
| US 9,142,532 | Chip-On-Wafer Bonding Method and Bonding Device, and Structure Comprising Chip and Wafer In force · High confidence | In force | High confidence | |
| US 9,870,922 | Substrate bonding apparatus and substrate bonding method In force · From the USPTO record | In force | From the USPTO record | |
| US 10,204,785 | Substrate bonding apparatus and substrate bonding method In force · From the USPTO record | In force | From the USPTO record | |
| US 10,580,752 | Method for bonding substrates together, and substrate bonding device In force · From the USPTO record | In force | From the USPTO record | |
| US 12,341,036 | Resin shaping device In force · From the USPTO record | In force | From the USPTO record | |
| US 12,261,147 | Bonding System and Bonding Method In force · High confidence | In force | High confidence | |
| US 12,388,045 | Bonding System and Bonding Method In force · High confidence | In force | High confidence |
Also on record, not counted in the 18: 2 patents in force now held by others · 5 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 pending · 2 no status recorded