Bondtech Co., Ltd.
Records under this name other than the patents Bondtech Co., Ltd. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 18 patents it holds.
Showing 1 to 7 of 7 · Back to Bondtech Co., Ltd.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,601,350 | Bonding-Substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-Substrate Fabrication Apparatus, and Substrate Assembly Formerly held In force · High confidence | In force | High confidence | |
| US 10,166,749 | Bonding-Substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-Substrate Fabrication Apparatus, and Substrate Assembly Formerly held In force · High confidence | In force | High confidence | |
| US 7,686,912 | Method for bonding substrates and method for irradiating particle beam to be utilized therefor Term ended Term ended Jun 8, 2026 · From the USPTO record | Term ended | Term ended Jun 8, 2026 | From the USPTO record |
| US 7,550,366 | Method for bonding substrates and device for bonding substrates Term ended Term ended Dec 2, 2025 · From the USPTO record | Term ended | Term ended Dec 2, 2025 | From the USPTO record |
| US 7,645,681 | Bonding method, device produced by this method, and bonding device Term ended Term ended Oct 27, 2025 · From the USPTO record | Term ended | Term ended Oct 27, 2025 | From the USPTO record |
| US 8,091,764 | Joining method and device produced by this method and joining unit Term ended Ended no later than Jan 21, 2025 · From the USPTO record | Term ended | Ended no later than Jan 21, 2025 | From the USPTO record |
| US 8,651,363 | Joining method and device produced by this method and joining unit Term ended Ended no later than Jan 21, 2025 · From the USPTO record | Term ended | Ended no later than Jan 21, 2025 | From the USPTO record |