Chip Packaging Technologies, LLC

48 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Ending by 2030

Jul 2027

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Dec 23, 2026
The maintenance fee for Heat Spreader for Integrated Circuit Device (US 9,064,838) comes due Dec 23, 2026. Unpaid by Jun 23, 2027, it lapses early.
2 fees due Jan 28 to 30, 2027 · next Jan 28
1 fee due Feb 13, 2027
The maintenance fee for Lead Frame Having Redistribution Layer (US 10,381,295) comes due Feb 13, 2027. Unpaid by Aug 13, 2027, it lapses early.
2 fees due Mar 8 to 19, 2027 · next Mar 8
2 fees due Apr 1 to 13, 2027 · next Apr 1
2 fees due May 17 to 24, 2027 · next May 17
1 fee due Jun 24, 2027
The maintenance fee for Lead Frame with Bendable Leads (US 10,515,880) comes due Jun 24, 2027. Unpaid by Dec 27, 2027, it lapses early.
2 fees due Aug 16 to 18, 2027 · next Aug 16
3 fees due Sep 29, 2027
1 fee due Oct 5, 2027
The maintenance fee for Semiconductor Device with Combined Power and Ground Ring Structure (US 9,305,898) comes due Oct 5, 2027. Unpaid by Apr 5, 2028, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

1 term has ended since Aug 16, 2026

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Patent	Title	Status	Expires	Confidence
US 7,772,036	Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(S) and Associated Method of Manufacturing In force Term ends Jul 5, 2027 · High confidence	In force	Term ends Jul 5, 2027	High confidence
US 8,736,034	Lead-Frame Circuit Package In force Term ends Nov 17, 2027 · High confidence	In force	Term ends Nov 17, 2027	High confidence
US 8,258,611	Leadframe Structure for Electronic Packages In force Term ends Apr 15, 2029 · High confidence	In force	Term ends Apr 15, 2029	High confidence
US 8,427,797	ESD Networks for Solder Bump Integrated Circuits In force Term ends Dec 4, 2029 · High confidence	In force	Term ends Dec 4, 2029	High confidence
US 8,394,713	Method of Improving Adhesion of Bond Pad Over Pad Metallization with a Neighboring Passivation Layer by Depositing a Palladium Layer In force Term ends Aug 27, 2030 · High confidence	In force	Term ends Aug 27, 2030	High confidence
US 8,802,474	Pressure Sensor and Method of Packaging Same In force Term ends Nov 10, 2031 · High confidence	In force	Term ends Nov 10, 2031	High confidence
US 8,716,846	Pressure Sensor and Method of Packaging Same In force Term ends Nov 13, 2031 · High confidence	In force	Term ends Nov 13, 2031	High confidence
US 8,536,684	Method of Assembling Shielded Integrated Circuit Device In force Term ends Nov 23, 2031 · High confidence	In force	Term ends Nov 23, 2031	High confidence
US 8,890,308	Integrated Circuit Package and Method of Forming the Same In force Term ends Apr 6, 2032 · High confidence	In force	Term ends Apr 6, 2032	High confidence
US 9,129,930	Power Transistor with Heat Dissipation and Method Therefore In force Term ends Jun 29, 2032 · High confidence	In force	Term ends Jun 29, 2032	High confidence

10 of 48 patents shown.

Pro members see all 48.

Pro members: see all 48 patents

Also on record, not counted in the 48: 2 ended at full term. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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