Chip Packaging Technologies, LLC
Records under this name other than the patents Chip Packaging Technologies, LLC holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 48 patents it holds.
Showing 1 to 2 of 2 · Back to Chip Packaging Technologies, LLC
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,659,146 | Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(S) and Associated Method of Manufacturing Term ended Term ended Sep 12, 2026 · High confidence | Term ended | Term ended Sep 12, 2026 | High confidence |
| US 8,013,452 | Wire-Bonded Semiconductor Component with Reinforced Inner Connection Metallization Term ended Term ended Mar 25, 2025 · High confidence | Term ended | Term ended Mar 25, 2025 | High confidence |