ChipPAC, Inc.
Records under this name other than patents ChipPAC, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,650,688 | Bonding Tool for Mounting Semiconductor Chips now held by Stats ChipPAC, Inc. In force · High confidence | In force | High confidence | |
| US 8,552,551 | Adhesive/Spacer Island Structure for Stacking Over Wire Bonded Die now held by Stats ChipPAC Pte. Lte In force · Medium confidence | In force | Medium confidence | |
| US 8,067,823 | Chip Scale Package Having Flip Chip Interconnect on Die Paddle now held by Stats ChipPAC, Inc. In force · High confidence | In force | High confidence | |
| US 7,690,551 | Die Attach by Temperature Gradient Lead Free Soft Solder Metal Sheet or Film now held by Stats ChipPAC, Inc. In force · High confidence | In force | High confidence | |
| US 7,671,451 | Semiconductor Package Having Double Layer Leadframe now held by Stats ChipPAC Pte. Lte Term ended Term ended May 30, 2026 · High confidence | Term ended | Term ended May 30, 2026 | High confidence |
| US 7,453,156 | Wire Bond Interconnection now held by Stats ChipPAC Pte. Lte Term ended Term ended May 2, 2026 · High confidence | Term ended | Term ended May 2, 2026 | High confidence |
| US 8,970,049 | Multiple chip package module having inverted package stacked over die now held by Stats ChipPAC Pte. Lte Term ended Term ended Feb 23, 2026 · High confidence | Term ended | Term ended Feb 23, 2026 | High confidence |
| US 7,880,313 | Semiconductor Flip Chip Package Having Substantially Non-Collapsible Spacer now held by Stats ChipPAC Pte. Lte Term ended Term ended Nov 17, 2025 · High confidence | Term ended | Term ended Nov 17, 2025 | High confidence |
| US 7,256,108 | Method for Reducing Semiconductor Die Warpage now held by Stats ChipPAC, Inc. Term ended Term ended Oct 18, 2025 · High confidence | Term ended | Term ended Oct 18, 2025 | High confidence |
| US 7,253,511 | Semiconductor Multipackage Module Including Die and Inverted Land Grid Array Package Stacked Over Ball Grid Array Package now held by Stats ChipPAC Pte. Ltd. Term ended Term ended Apr 4, 2025 · High confidence | Term ended | Term ended Apr 4, 2025 | High confidence |