Five patents currently held, every record listed here
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
The next term ends in Jun 2038. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
0
Ending by 2030
Jun 2038
Next term end
5
Patent families
When these terms end
Each bar runs from grant to computed term end. 2019 to 2045.
US 10,524,349
Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board
Jun 1, 2038
US 11,043,911
Motor Control Device with Built-in Current Sensing Resistor and Power Transistor
Jan 1, 2040
US 10,743,411
Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad, and Method for Fabricating the Component
Jan 8, 2040
US 12,666,527
Thermal Conduction - Electrical Conduction Isolated Circuit Board with Ceramic Substrate and Power Transistor Embedded
Feb 28, 2045
202420292034203920442045
1 pending application: term is not computable until grant.Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Jun 2038 · High confidence
Also notable
Ends Jan 2040 · High confidence
Also notable
Ends Jan 2040 · High confidence
Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board
US 10,524,349
The earliest of the three still in force, granted 2019 and renewed since. Its term ends first, in 2038.
Motor Control Device with Built-in Current Sensing Resistor and Power Transistor
US 11,043,911
The newest of the three, granted 2021. It anchors the portfolio to 2040, later than anything else here.
Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad, and Method for Fabricating the Component
US 10,743,411
Granted 2020. Computed term ends 2040.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jun 30, 2027The maintenance fee for Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board (US 10,524,349) comes due Jun 30, 2027. Unpaid by Jan 3, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first.
Showing 1 to 5 of 5
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 10,524,349 | Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board In force · High confidence | In force | High confidence | |
| US 11,043,911 | Motor Control Device with Built-in Current Sensing Resistor and Power Transistor held by Icp Technology Co., Ltd. and Sentec E&E Co., Ltd. In force · High confidence | In force | High confidence | |
| US 10,743,411 | Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad, and Method for Fabricating the Component In force · High confidence | In force | High confidence | |
| US 12,463,188 | Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver In force · High confidence | In force | High confidence | |
| US 12,666,527 | Thermal Conduction - Electrical Conduction Isolated Circuit Board with Ceramic Substrate and Power Transistor Embedded held by Icp Technology Co., Ltd. and Sentec E&E Co., Ltd. In force · High confidence | In force | High confidence |
Also on record, not counted in the 5: 1 application pending. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.