Powertech Technology Inc.
Records under this name other than the patents Powertech Technology Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 137 patents it holds.
Back to Powertech Technology Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,761,568 | Thin fan-out multi-chip stacked packages and the method for manufacturing the same Formerly held In force · From the USPTO record | In force | From the USPTO record | |
| US 9,627,228 | Method for manufacturing a chip package having a coating layer Lapsed on the fee record Ended Apr 18, 2025 · From the USPTO record | Lapsed on the fee record | Ended Apr 18, 2025 | From the USPTO record |
| US 8,378,483 | Fabrication process and device of multi-chip package having spliced substrates Lapsed on the fee record Ended Feb 19, 2025 · From the USPTO record | Lapsed on the fee record | Ended Feb 19, 2025 | From the USPTO record |
| US 9,553,036 | Semiconductor package and manufacturing method thereof Lapsed on the fee record Ended Jan 24, 2025 · From the USPTO record | Lapsed on the fee record | Ended Jan 24, 2025 | From the USPTO record |
| US 8,237,273 | Metal post chip connecting device and method free to use soldering material Lapsed on the fee record Ended Aug 7, 2024 · From the USPTO record | Lapsed on the fee record | Ended Aug 7, 2024 | From the USPTO record |
| US 8,212,349 | Semiconductor package having chip using copper process Lapsed on the fee record Ended Jul 3, 2024 · From the USPTO record | Lapsed on the fee record | Ended Jul 3, 2024 | From the USPTO record |
| US 10,424,526 | Chip package structure and manufacturing method thereof Lapsed on the fee record Ended Sep 24, 2023 · From the USPTO record | Lapsed on the fee record | Ended Sep 24, 2023 | From the USPTO record |
| US 9,099,364 | MPS-C2 semiconductor device having shorter supporting posts Lapsed on the fee record Ended Aug 4, 2023 · From the USPTO record | Lapsed on the fee record | Ended Aug 4, 2023 | From the USPTO record |
| US 10,354,978 | Stacked package including exterior conductive element and a manufacturing method of the same Lapsed on the fee record Ended Jul 16, 2023 · From the USPTO record | Lapsed on the fee record | Ended Jul 16, 2023 | From the USPTO record |
| US 10,276,553 | Chip package structure and manufacturing method thereof Lapsed on the fee record Ended Apr 30, 2023 · From the USPTO record | Lapsed on the fee record | Ended Apr 30, 2023 | From the USPTO record |