Stats ChipPAC, Ltd.
Records under this name other than the patents Stats ChipPAC, Ltd. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 234 patents it holds.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,746,656 | Offset Integrated Circuit Package-On-Package Stacking System now held by Stats ChipPAC Pte. Lte. In force · High confidence | In force | High confidence | |
| US 7,368,319 | Stacked Integrated Circuit Package-In-Package System now held by Stats ChipPAC Management Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 7,939,368 | Wafer Level Chip Scale Package System with a Thermal Dissipation Structure now held by Stats ChipPAC Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 8,093,694 | Method of Manufacturing Non-Leaded Integrated Circuit Package System Having Etched Differential Height Lead Structures now held by Stats ChipPAC Management Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 8,030,755 | Integrated Circuit Package System with a Heat Sink now held by Stats ChipPAC Management Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 7,833,840 | Integrated Circuit Package System with Down-Set Die Pad and Method of Manufacture Thereof now held by Stats ChipPAC Management Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 8,729,687 | Stackable Integrated Circuit Package System now held by Stats ChipPAC Management Pte. Ltd. In force · High confidence | In force | High confidence | |
| US 8,072,059 | Semiconductor Device and Method of Forming Ubm Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die now held by Stats ChipPAC Pte. Lte. In force · High confidence | In force | High confidence | |
| US 9,449,925 | Integrated Passive Devices now held by Jcet Semiconductor (Shaoxing) Co., Ltd. In force · High confidence | In force | High confidence | |
| US 7,501,697 | Integrated Circuit Package System now held by Stats ChipPAC Management Pte. Ltd. In force · High confidence | In force | High confidence |