The Patent Finder
ZD

Zhen Ding Technology Co., Ltd.

First filing 2006
OverviewNotableFeesChangesFamiliesPatent listSources & methods

45 patents currently held

36 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

The next term ends in Feb 2033. from the record

Of the 36 now held by other companies, 28 name Avary Holding Shenzhen Co. Limited as their current owner, and 8 more name another party. Each row says which.

Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
0
Ending by 2030
Feb 2033
Next term end
39
Patent families

When these terms end

Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
notable patents fee due within 90 days all others Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.

Notable patents

Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Method for Manufacturing Printed Circuit Baord US 9,107,332
The most cited patent in this portfolio, cited by 38 later US patents, top 25% of utility patents granted in 2015 in our data. Protection runs to 2033.
Ends Nov 2033 · High confidence Also notable
Package on Package Structrue and Method for Manufacturing Same US 8,853,000
Renewed at every maintenance window since the 2014 grant; no more fees are due before its term ends in 2033.
Ends Feb 2033 · High confidence Also notable
Method for Manufacturing Package Structure US 9,786,589
Granted 2017 and renewed at every maintenance window due so far. Protection runs to 2035.
Ends Sep 2035 · High confidence

Formerly held, still cited

Notable
Ultrathin Heat Dissipation Structure US 10,448,540
The newest of the three, granted 2019. It anchors the portfolio to 2037, later than anything else here.
now held by Avary Holding (Shenzhen) Co., Limited.
Ends Jun 2037 · High confidence

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
  • 3 fees due Dec 6 to 25, 2026 · next Dec 6
  • 1 fee due Jan 21, 2027
    The maintenance fee for Printed Circuit Board with Embedded Component and Method for Manufactruing Same (US 9,089,082) comes due Jan 21, 2027. Unpaid by Jul 21, 2027, it lapses early.
  • 3 fees due Feb 1 to 11, 2027 · next Feb 1
  • 2 fees due Mar 10 to 24, 2027 · next Mar 10
  • 4 fees due Apr 1 to 27, 2027 · next Apr 1
  • 1 fee due May 17, 2027
    The maintenance fee for Substrate, Chip Package and Method for Manufacturing Substrate (US 9,190,386) comes due May 17, 2027. Unpaid by Nov 17, 2027, it lapses early.
  • 1 fee due Jul 2, 2027
    The maintenance fee for Method for Manufacturing a Block Copolymer of Polyamide Acid (US 11,859,038) comes due Jul 2, 2027. Unpaid by Jan 3, 2028, it lapses early.
  • 2 fees due Aug 16 to 23, 2027 · next Aug 16
  • 1 fee due Sep 22, 2027
    The maintenance fee for Method for Manufacturing a Printed Circuit Board (US 9,295,150) comes due Sep 22, 2027. Unpaid by Mar 22, 2028, it lapses early.
  • 1 fee due Nov 3, 2027
    The maintenance fee for Interposer and Method for Manufacturing Same (US 9,332,656) comes due Nov 3, 2027. Unpaid by May 3, 2028, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

  • 1 term has ended since Aug 17, 2026

What they patent

The 5 largest of its 39 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
Low Dielectric Resin Composition, Film and Circuit Board Using the Same2 in forceto Aug 2038
Resin Composition, Polyimide Film and Method for Manufacturing Polyimide Film2 in forceto Aug 2037
Method of Manufacturing a Package Substrate2 in forceto Feb 2036
Method for Manufacturing Package Structure2 in forceto Sep 2035
Packaging Substrate and Method for Manufacturing Same2 in forceto Dec 2033

Patents held now

Soonest term end first.
PatentTitleStatusExpiresConfidence
US 8,853,000Package on Package Structrue and Method for Manufacturing Same
In force
 · High confidence
In forceHigh confidence
US 9,000,573Package on Package Structure and Method for Manufacturing Same
In force
 · High confidence
In forceHigh confidence
US 8,951,848Circuit Substrate for Mounting Chip, Method for Manufacturing Same and Chip Package Having Same
In force
 · High confidence
In forceHigh confidence
US 9,295,150Method for Manufacturing a Printed Circuit Board
In force
 · High confidence
In forceHigh confidence
US 9,015,936Method for Manufacturing Ic Substrate
In force
 · High confidence
In forceHigh confidence
US 9,024,203Embedded Printed Circuit Board and Method for Manufacturing Same
In force
 · High confidence
In forceHigh confidence
US 9,107,332Method for Manufacturing Printed Circuit Baord
In force
 · High confidence
In forceHigh confidence
US 9,165,790Packaging Substrate, Method for Manufacturing Same, and Chip Packaging Body Having Same
In force
 · High confidence
In forceHigh confidence
US 9,099,450Package Structure and Method for Manufacturing Same
In force
 · High confidence
In forceHigh confidence
US 8,941,227Package Structure and Method for Manufacturing Same
In force
 · High confidence
In forceHigh confidence
10 of 45 patents shown.
Pro members see all 45.
Pro members: see all 45 patents
Also on record, not counted in the 45: 36 patents in force now held by others · 64 patents ended · 76 applications abandoned. List them

Sources and methods

Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Export every term end as CSV · Pro
The Patent Finder CompaniesExpirationsCalculatorWatchlistPricing MethodologyCorrectionsLegalPrivacysupport@thepatentfinder.com Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) Part of 137 Finder · © 2026 137 Finder LLC · Sources cited