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Wafer-Level Fabrication of Lidded Chips with Electrodeposited Dielectric Coating

US 7,935,568 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Oct 31, 2026 · High confidence

Filed Oct 31, 2006 as application 11/590,616 · Granted May 3, 2011
Base term, 20 years from filing
Today
20 years from filing
Term ended Oct 31, 2026
2006 2026
Clock starts
Oct 31, 2006
Term ended
Oct 31, 2026
Granted
May 3, 2011
base term after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
10
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees were paid, so no fee lapse ended it. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Oct 31, 2006, when this application, 11/590,616, was filedOct 31, 2026High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidterm endedHigh confidence
Computed term endThe steps above, in orderOct 31, 2026High confidence

This family

US 6,972,480Term ended
Jun 2023
Jun 2023
US 7,192,796Term ended
Jul 2024
Jul 2024
US 7,265,440Term ended
Aug 2023
Aug 2023
US 7,935,568this patent
Oct 2026
Oct 2026
US 7,495,341Term ended
Dec 2024
Dec 2024
US 7,807,508Term ended
Oct 2026
Oct 2026
US 7,642,629Term ended
Jun 2023
Jun 2023
US 7,479,398Term ended
Jul 2024
Jul 2024
8 of 10 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Jan 3, 2007
Reel 18706, frame 709
Oganesian, Vage; Ovrutsky, David; Rosenstein, Charles; Haba, Belgachem; Humpston, GilesTessera Technologies Hungary KFT.Assignment of Assignor's Interest
Dec 17, 2010
Reel 25592, frame 734
Tessera Technologies Hungary Holding Limited Liability CompanyTessera Technologies Ireland LimitedAssignment of Assignor's Interest
Aug 11, 2011
Reel 26739, frame 875
Tessera Technologies Ireland LimitedDigitalOptics Corporation Europe LimitedChange of Name
Oct 26, 2011
Reel 27137, frame 397
Tessera Technologies Ireland LimitedDigitalOptics Corporation Europe LimitedCorrection to Reel 026739 Frame 0875 to Correction the Address of Receiving Party.
Mar 20, 2013
Reel 30065, frame 817
DigitalOptics Corporation Europe LimitedInvensas CorporationAssignment of Assignor's Interest
Dec 2, 2016
Reel 40797, frame 1
Invensas Corporation; Tessera, Inc.; Tessera Advanced Technologies, Inc.; Ziptronix, Inc.; DigitalOptics Corporation; DigitalOptics Corporation Mems; DTS, LLC; DTS, Inc.; Phorus, Inc.; Ibiquity Digital CorporationRoyal Bank of Canada, as Collateral AgentSecurity Interest
Jun 1, 2020
Reel 53468, frame 1
Rovi Solutions Corporation; Rovi Technologies Corporation; Rovi Guides, Inc.; TiVo Solutions Inc.; Veveo, Inc.; Invensas Corporation; Invensas Bonding Technologies, Inc.; Tessera, Inc.; Tessera Advanced Technologies, Inc.; DTS, Inc.; Phorus, Inc.; Ibiquity Digital CorporationBank Of America, N.a.Security Interest
Jun 11, 2020
Reel 52920, frame 1
Royal Bank of CanadaTessera, Inc.; Invensas Bonding Technologies, Inc. (F/K/A Ziptronix, Inc.); FotoNation Corporation (F/K/A DigitalOptics Corporation and F/K/A DigitalOptics Corporation Mems); Invensas Corporation; Tessera Advanced Technologies, Inc.; DTS, Inc.; DTS LLC; Phorus, Inc.; Ibiquity Digital CorporationRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaTessera, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaInvensas Bonding Technologies, Inc. (F/K/A Ziptronix, Inc.)Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaFotoNation Corporation (F/K/A DigitalOptics Corporation and F/K/A DigitalOptics Corporation Mems)Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaInvensas CorporationRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaTessera Advanced Technologies, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaDTS, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaDTS LLCRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaPhorus, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaIbiquity Digital CorporationRelease of Security Interest
Nov 24, 2025
Reel 73508, frame 758
Invensas CorporationInvensas LLCChange of Name
Nov 24, 2025
Reel 73508, frame 807
Invensas LLCAdeia Semiconductor Technologies LLCChange of Name

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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