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US

Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies

US 9,153,517 In force
OverviewFamilyAssignmentsSources & methods

Also listed on Vertical Circuits, Inc., an earlier holder on the record. The recorded assignments below show how it moved.

Term ends Jun 7, 2031 · High confidence

Filed May 17, 2011 as application 13/109,996 · Granted Oct 6, 2015
Base term plus 21 days of patent term adjustment (USPTO delay)
Today
20 years from filing
2011 2031
Clock starts
May 17, 2011
Term ends
Jun 7, 2031
Granted
Oct 6, 2015
base term patent term adjustment fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
21
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
2 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
2
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 21 days past its 20-year base term on prosecution delay. 2 of 3 maintenance fees are paid so far. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts May 17, 2011, when this application, 13/109,996, was filedMay 17, 2031High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+21 days, USPTO patent term adjustment recordJun 7, 2031High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events2 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderJun 7, 2031High confidence

This family

US 9,153,517this patent
Jun 2031
Jun 2031
US 9,508,689In force
May 2031
May 2031
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Jun 16, 2011
Reel 26477, frame 938
Co., Reynaldo; Leal, Jeffrey S.; Pangrle, Suzette K.; McGrath, Scott; Melcher, Deann Eileen; Barrie, Keith L.; Villavicencio, Grant; Del Rosario, Elmer M.; Bray, John R.Vertical Circuits, Inc.Assignment of Assignor's Interest
Oct 24, 2012
Reel 29186, frame 755
Vertical Circuits, Inc.Vertical Circuits (Assignment for the Benefit of Creditors), LLCAssignment of Assignor's Interest
Dec 6, 2012
Reel 29458, frame 905
Vertical Circuits (Assignment for the Benefit of Creditors), LLCInvensas CorporationAssignment of Assignor's Interest
Dec 2, 2016
Reel 40797, frame 1
Invensas Corporation; Tessera, Inc.; Tessera Advanced Technologies, Inc.; Ziptronix, Inc.; DigitalOptics Corporation; DigitalOptics Corporation Mems; DTS, LLC; DTS, Inc.; Phorus, Inc.; Ibiquity Digital CorporationRoyal Bank of Canada, as Collateral AgentSecurity Interest
Jun 1, 2020
Reel 53468, frame 1
Rovi Solutions Corporation; Rovi Technologies Corporation; Rovi Guides, Inc.; TiVo Solutions Inc.; Veveo, Inc.; Invensas Corporation; Invensas Bonding Technologies, Inc.; Tessera, Inc.; Tessera Advanced Technologies, Inc.; DTS, Inc.; Phorus, Inc.; Ibiquity Digital CorporationBank Of America, N.a.Security Interest
Jun 11, 2020
Reel 52920, frame 1
Royal Bank of CanadaTessera, Inc.; Invensas Bonding Technologies, Inc. (F/K/A Ziptronix, Inc.); FotoNation Corporation (F/K/A DigitalOptics Corporation and F/K/A DigitalOptics Corporation Mems); Invensas Corporation; Tessera Advanced Technologies, Inc.; DTS, Inc.; DTS LLC; Phorus, Inc.; Ibiquity Digital CorporationRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaTessera, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaInvensas Bonding Technologies, Inc. (F/K/A Ziptronix, Inc.)Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaFotoNation Corporation (F/K/A DigitalOptics Corporation and F/K/A DigitalOptics Corporation Mems)Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaInvensas CorporationRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaTessera Advanced Technologies, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaDTS, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaDTS LLCRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaPhorus, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaIbiquity Digital CorporationRelease of Security Interest
Nov 24, 2025
Reel 73508, frame 745
Invensas LLCAdeia Semiconductor Technologies LLCChange of Name
Nov 24, 2025
Reel 73941, frame 814
Invensas CorporationInvensas LLCChange of Name

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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