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Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies

US 9,508,689 In force
OverviewFamilyAssignmentsSources & methods

Term ends May 17, 2031 · High confidence

Filed Sep 30, 2015 as application 14/871,185 · Granted Nov 29, 2016
Base term, 20 years from filing
Today
20 years from filing
2011 2031
Clock starts
May 17, 2011
Term ends
May 17, 2031
Granted
Nov 29, 2016
base term fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
2 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
2
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. 2 of 3 maintenance fees are paid so far. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts May 17, 2011, when application 13/109,996, the earliest non-provisional in its chain, was filed (this one was filed Sep 30, 2015)May 17, 2031High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events2 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderMay 17, 2031High confidence

This family

US 9,153,517In force
Jun 2031
Jun 2031
US 9,508,689this patent
May 2031
May 2031
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Oct 1, 2015
Reel 36705, frame 14
Co., Reynaldo; Leal, Jeffrey S.; Pangrle, Suzette K.; McGrath, Scott; Melcher, Deann Eileen; Barrie, Keith L.; Villavicencio, Grant; Del Rosario, Elmer M.; Bray, John R.Vertical Circuits, Inc.Assignment of Assignor's Interest
Oct 5, 2015
Reel 36726, frame 409
Vertical Circuits, Inc.Vertical Circuits (Assignment for the Benefit of Creditors), LLCAssignment of Assignor's Interest
Oct 6, 2015
Reel 36736, frame 684
Vertical Circuits (Assignment for the Benefit of Creditors), LLCInvensas CorporationAssignment of Assignor's Interest
Dec 2, 2016
Reel 40797, frame 1
Invensas Corporation; Tessera, Inc.; Tessera Advanced Technologies, Inc.; Ziptronix, Inc.; DigitalOptics Corporation; DigitalOptics Corporation Mems; DTS, LLC; DTS, Inc.; Phorus, Inc.; Ibiquity Digital CorporationRoyal Bank of Canada, as Collateral AgentSecurity Interest
Jun 1, 2020
Reel 53468, frame 1
Rovi Solutions Corporation; Rovi Technologies Corporation; Rovi Guides, Inc.; TiVo Solutions Inc.; Veveo, Inc.; Invensas Corporation; Invensas Bonding Technologies, Inc.; Tessera, Inc.; Tessera Advanced Technologies, Inc.; DTS, Inc.; Phorus, Inc.; Ibiquity Digital CorporationBank Of America, N.a.Security Interest
Jun 11, 2020
Reel 52920, frame 1
Royal Bank of CanadaTessera, Inc.; Invensas Bonding Technologies, Inc. (F/K/A Ziptronix, Inc.); FotoNation Corporation (F/K/A DigitalOptics Corporation and F/K/A DigitalOptics Corporation Mems); Invensas Corporation; Tessera Advanced Technologies, Inc.; DTS, Inc.; DTS LLC; Phorus, Inc.; Ibiquity Digital CorporationRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaTessera, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaInvensas Bonding Technologies, Inc. (F/K/A Ziptronix, Inc.)Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaFotoNation Corporation (F/K/A DigitalOptics Corporation and F/K/A DigitalOptics Corporation Mems)Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaInvensas CorporationRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaTessera Advanced Technologies, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaDTS, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaDTS LLCRelease of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaPhorus, Inc.Release of Security Interest
Jun 11, 2020
reel/frame not recorded
Royal Bank of CanadaIbiquity Digital CorporationRelease of Security Interest
Nov 24, 2025
Reel 73508, frame 745
Invensas LLCAdeia Semiconductor Technologies LLCChange of Name
Nov 24, 2025
Reel 73941, frame 814
Invensas CorporationInvensas LLCChange of Name

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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